参数类型
| 型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74ALVC245BQ | n.a. | n.a. | TTL | ± 24 | 2.3 | 8 | 130 | low | -40~85 | DHVQFN20 |
| 74ALVC245D | n.a. | n.a. | TTL | ± 24 | 2.3 | 8 | 130 | low | -40~85 | SO20 |
| 74ALVC245PW | n.a. | n.a. | TTL | ± 24 | 2.3 | 8 | 130 | low | -40~85 | TSSOP20 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74ALVC245BQ | 74ALVC245BQ,115 (935285552115) |
Active | ALVC245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74ALVC245D | 74ALVC245D,118 (935269727118) |
Active | 74ALVC245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74ALVC245PW | 74ALVC245PW,118 (935269726118) |
Active | ALVC245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74ALVC245BQ | 74ALVC245BQ,115 | 74ALVC245BQ |
|
|
| 74ALVC245D | 74ALVC245D,118 | 74ALVC245D |
|
|
| 74ALVC245PW | 74ALVC245PW,118 | 74ALVC245PW |
|
|
文档 (15)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74ALVC245 | Octal bus transceiver; 3-state | Data sheet | 2023-07-11 |
| mna174 | Block diagram: 74AHC245D, 74AHC245PW, 74AHCT245D, 74AHCT245PW, 74LV245D, 74LV245DB, 74LV245N, 74LV245PW, 74AHC245D, 74AHC245PW, 74AHCT245D, 74AHCT245PW, 74ALVC245BQ, 74ALVC245D, 74ALVC245PW, 74LVC2245ABQ, 74LVC2245AD, 74LVC2245ADB, 74LVC2245APW, 74LVC245ABQ, 74LVC245ABX, 74LVC245AD, 74LVC245ADB, 74LVC245APW, 74LVCH245ABQ, 74LVCH245ABX, 74LVCH245AD, 74LVCH245ADB, 74LVCH245APW | Block diagram | 2009-11-04 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| alvc245 | alvc245 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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