特性
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Wide supply voltage range from 1.0 to 5.5 V
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CMOS low power dissipation
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Optimized for low voltage applications: 1.0 V to 3.6 V
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Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V
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Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 °C
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Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and Tamb = 25 °C
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Complies with JEDEC standards:
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
- JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LV00BQ | Production | 1.0 - 5.5 | TTL | ± 12 | 7.0 | 30 | 4 | low | -40~125 | 95 | 11.7 | 62 | DHVQFN14 |
| 74LV00D | Production | 1.0 - 5.5 | TTL | ± 12 | 7.0 | 30 | 4 | low | -40~125 | 93 | 10.3 | 51 | SO14 |
| 74LV00PW | Production | 1.0 - 5.5 | TTL | ± 12 | 7.0 | 30 | 4 | low | -40~125 | 131 | 4.5 | 56.3 | TSSOP14 |
封装
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| 74LV00BQ |  DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | LV00 | 74LV00BQ,115 ( 9352 855 59115 ) | |
| 74LV00D |  SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74LV00D | 74LV00D,118 ( 9350 630 80118 ) |
| 74LV00PW |  TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | LV00 | 74LV00PW,118 ( 9351 741 00118 ) |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| 74LV00BQ | 74LV00BQ,115 | 74LV00BQ |  |   | Always Pb-free |
| 74LV00D | 74LV00D,118 | 74LV00D | | | week 5, 2004 |
| 74LV00PW | 74LV00PW,118 | 74LV00PW | | | week 10, 2005 |
文档 (12)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74LV00 | Quad 2-input NAND gate | Data sheet | 2024-01-22 |
| lv00 | 74LV00 IBIS model | IBIS model | 2019-01-09 |
| 74LV00U_041 | 74LV00U/C4; Reel dry pack, SMD, 7" Q2/T3 No mark chip Orderable part number ending ,041 or Z Ordering code (12NC) ending 041 | Packing information | 2020-04-27 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| lv | lv Spice model | SPICE model | 2013-05-06 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
支持
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样品
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