特性
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Wide supply voltage range from 1.65 V to 5.5 V
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Very low ON resistance:
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7.5 Ω (typical) at VCC = 2.7 V
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6.5 Ω (typical) at VCC = 3.3 V
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6 Ω (typical) at VCC = 5 V
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32 mA continuous switch current
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Break-before-make switching
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High noise immunity
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CMOS low power dissipation
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TTL interface compatibility at 3.3 V
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Latch-up performance meets requirements of JESD 78 Class I
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Overvoltage tolerant control inputs to 5.5 V
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
Type number | Product status | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC1G3157GM | Production | SPDT | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 286 | 6.3 | 142 | XSON6 |
74LVC1G3157GN | Production | SPDT | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 262 | 9.4 | 163 | XSON6 |
74LVC1G3157GS | Production | SPDT | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 261 | 11.8 | 169 | XSON6 |
74LVC1G3157GV | Production | SPDT | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 227 | 35.5 | 141 | TSOP6 |
74LVC1G3157GW | Production | SPDT | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 261 | 35.7 | 150 | TSSOP6 |
74LVC1G3157GX | Production | SPDT | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 421 | 7.0 | 198 | X2SON6 |
(-) dash denotes: "Parameter value not specified for this product"
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LVC1G3157GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | YJ | 74LVC1G3157GM,132 ( 9352 772 28132 ) |
SOT886_115 | Active | YJ | 74LVC1G3157GM,115 ( 9352 772 28115 ) | ||||
74LVC1G3157GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | YJ | 74LVC1G3157GN,132 ( 9352 917 83132 ) |
74LVC1G3157GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | YJ | 74LVC1G3157GS,132 ( 9352 929 08132 ) |
74LVC1G3157GV | TSOP6 (SOT457) | SOT457 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT457_125 | Active | YJ | 74LVC1G3157GV,125 ( 9352 772 29125 ) |
74LVC1G3157GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | YJ | 74LVC1G3157GW,125 ( 9352 772 31125 ) | |
74LVC1G3157GX | X2SON6 (SOT1255) | SOT1255 | REFLOW_BG-BD-1 | SOT1255_147 | Active | YJ | 74LVC1G3157GXZ ( 9353 086 36147 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74LVC1G3157GM | 74LVC1G3157GM,132 | 74LVC1G3157GM | Always Pb-free | ||
74LVC1G3157GM | 74LVC1G3157GM,115 | 74LVC1G3157GM | Always Pb-free | ||
74LVC1G3157GN | 74LVC1G3157GN,132 | 74LVC1G3157GN | Always Pb-free | ||
74LVC1G3157GS | 74LVC1G3157GS,132 | 74LVC1G3157GS | Always Pb-free | ||
74LVC1G3157GV | 74LVC1G3157GV,125 | 74LVC1G3157GV | Always Pb-free | ||
74LVC1G3157GW | 74LVC1G3157GW,125 | 74LVC1G3157GW | Always Pb-free | ||
74LVC1G3157GX | 74LVC1G3157GXZ | 74LVC1G3157GX | week 25, 2019 |
文档 (22)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC1G3157 | 10 Ohm single-pole double-throw analog switch | Data sheet | 2023-08-23 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc1g3157 | 74LVC1G3157 IBIS model | IBIS model | 2016-04-27 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT1255 | plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-31 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
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模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
lvc1g3157 | 74LVC1G3157 IBIS model | IBIS model | 2016-04-27 |
样品
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