NG体育娱乐,ng体育平台

×

NXT4559

SIM card interface level translator

The NXT4559 device is built for interfacing a SIM card with a single low-voltage host side interface. The NXT4559 has three level translators to convert the data, RST and CLK signals between a SIM card and a host microcontroller. A high speed level translation capable of supporting class-B, class-C SIM cards. VCC_SIM power-down initiates a shutdown sequence on SIM card pins in accordance with ISO-7816-3.

The NXT4559 is compliant with all ETSI, IMT-2000 and ISO-7816 SIM/Smart card interface requirements.

特性

  • Support SIM cards and eSIM with supply voltages 1.62 V to 3.3 V

  • Host micro-controller operating voltage range: 1.08 V to 1.98 V

  • Automatic level translation of I/O, RST and CLK between SIM card and host side interface with capacitance isolation

  • Incorporates shutdown feature for the SIM card signals according to ISO-7816-3

  • High Vdis(UVLO_AC) switching level, arranging quick shut down when VCC_SIM powers down

  • Integrated pull-up resistors; no external resistor required

  • Integrated EMI Filters suppresses higher harmonics of digital I/O's

  • Low current shutdown mode < 1 μA

  • Supports clock speed beyond 5 MHz clock

  • Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • IEC61000-4-2 level 4, contact and air discharge on all SIM card-side pins exceeds 8 kV and 15 kV

  • Available in 9-pin wafer level chip-scale package (WLCSP); 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body; 0.35 mm pitch

  • Specified from -40 °C to +85 °C

目标应用

  • NXT4559 can be used with a range of SIM card attached devices including:

    • mobiles and personal phoness

    • Wireless modems

    • SIM card terminals

参数类型

Type numberProduct statusPackage name
NXT4559UPProductionWLCSP9

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
NXT4559UP
WLCSP9
(SOT8027-1)
SOT8027-1SOT8027-1_336Activez9NXT4559UPZ
( 9356 917 09336 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
NXT4559UPNXT4559UPZNXT4559UP
品质及可靠性免责声明

文档 (3)

文件名称标题类型日期
NXT4559SIM card interface level translatorData sheet2024-02-27
nxt4559upNXT4559UP IBIS modelIBIS model2023-12-21
SOT8027-1wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm bodyPackage information2022-09-27

支持

如果您需要设计/技术支持,请告知我们并填写 应答表, 我们会尽快回复您。

模型

文件名称标题类型日期
nxt4559upNXT4559UP IBIS modelIBIS model2023-12-21

订购、定价与供货

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品

NG体育娱乐,ng体育平台