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双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HC74-Q100; 74HCT74-Q100

Dual D-type flip-flop with set and reset; positive edge-trigger

The 74HC74-Q100; 74HCT74-Q100 are dual positive edge triggered D-type flip-flop with individual data (nD), clock (nCP), set (nSD) and reset (nRD) inputs, and complementary nQ and nQ outputs. Data at the nD-input, that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition, will be stored in the flip-flop and appear at the nQ output. The Schmitt-trigger action in the clock input, makes the circuit highly tolerant to slower clock rise and fall times. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Input levels:

    • For 74HC74-Q100: CMOS level

    • For 74HCT74-Q100: TTL level

  • Symmetrical output impedance

  • Low power dissipation

  • High noise immunity

  • Balanced propagation delays

  • Specified in compliance with JEDEC standard no. 7A

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Power dissipation considerations Tamb (°C) Package name
74HC74BQ-Q100 2.0 - 6.0 CMOS ± 5.2 14 82 low -40~125 DHVQFN14
74HC74D-Q100 2.0 - 6.0 CMOS ± 5.2 14 82 low -40~125 SO14
74HC74PW-Q100 2.0 - 6.0 CMOS ± 5.2 14 82 low -40~125 TSSOP14
74HCT74BQ-Q100 4.5 - 5.5 TTL ± 4 15 59 low -40~125 DHVQFN14
74HCT74D-Q100 4.5 - 5.5 TTL ± 4 15 59 low -40~125 SO14
74HCT74PW-Q100 4.5 - 5.5 TTL ± 4 15 59 low -40~125 TSSOP14

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HC74BQ-Q100 74HC74BQ-Q100,115
(935298879115)
Active HC74 SOT762-1
DHVQFN14
(SOT762-1)
SOT762-1 SOT762-1_115
74HC74D-Q100 74HC74D-Q100,118
(935298881118)
Active 74HC74D SOT108-1
SO14
(SOT108-1)
SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_118
74HC74PW-Q100 74HC74PW-Q100,118
(935298882118)
Active HC74 SOT402-1
TSSOP14
(SOT402-1)
SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118
74HCT74BQ-Q100 74HCT74BQ-Q100,115
(935298883115)
Active HCT74 SOT762-1
DHVQFN14
(SOT762-1)
SOT762-1 SOT762-1_115
74HCT74D-Q100 74HCT74D-Q100,118
(935298884118)
Active 74HCT74D SOT108-1
SO14
(SOT108-1)
SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_118
74HCT74PW-Q100 74HCT74PW-Q100,118
(935298885118)
Active HCT74 SOT402-1
TSSOP14
(SOT402-1)
SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HC74BQ-Q100 74HC74BQ-Q100,115 74HC74BQ-Q100 rohs rhf rhf
74HC74D-Q100 74HC74D-Q100,118 74HC74D-Q100 rohs rhf rhf
74HC74PW-Q100 74HC74PW-Q100,118 74HC74PW-Q100 rohs rhf rhf
74HCT74BQ-Q100 74HCT74BQ-Q100,115 74HCT74BQ-Q100 rohs rhf rhf
74HCT74D-Q100 74HCT74D-Q100,118 74HCT74D-Q100 rohs rhf rhf
74HCT74PW-Q100 74HCT74PW-Q100,118 74HCT74PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (20)

文件名称 标题 类型 日期
74HC_HCT74_Q100 Dual D-type flip-flop with set and reset; positive edge-trigger Data sheet 2024-04-02
AN11044 Pin FMEA 74HC/74HCT family Application note 2019-01-09
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
hc74 74HC74 IBIS model IBIS model 2022-10-21
hct74 74HCT74 IBIS model IBIS model 2022-10-21
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN14_SOT762-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body Marcom graphics 2017-01-28
SO14_SOT108-1_mk plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Marcom graphics 2017-01-28
TSSOP14_SOT402-1_mk plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT762-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body Package information 2023-04-05
SOT108-1 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT402-1 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-07
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
hc HC/HCT Spice model SPICE model 2022-02-17
HCT_USER_GUIDE HC/T User Guide User manual 1997-10-31
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
hc74 74HC74 IBIS model IBIS model 2022-10-21
hct74 74HCT74 IBIS model IBIS model 2022-10-21
hc HC/HCT Spice model SPICE model 2022-02-17

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