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    74AUP1G16

    Low-power buffer

    The 74AUP1G16 provides a low-power, low-voltage single buffer.

    Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

    This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

    This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 0.8 V to 3.6 V

    • High noise immunity

    • Complies with JEDEC standards:

      • JESD8-12 (0.8 V to 1.3 V)

      • JESD8-11 (0.9 V to 1.65 V)

      • JESD8-7 (1.2 V to 1.95 V)

      • JESD8-5 (1.8 V to 2.7 V)

      • JESD8-B (2.7 V to 3.6 V)

    • Low static power consumption; ICC = 0.9 μA (maximum)

    • Latch-up performance exceeds 100 mA per JESD 78 Class II

    • Inputs accept voltages up to 3.6 V

    • Low noise overshoot and undershoot < 10 % of VCC

    • IOFF circuitry provides partial power-down mode operation

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
    74AUP1G16GMProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125311157XSON6
    74AUP1G16GWProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125309179TSSOP5

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74AUP1G16GM
    XSON6
    (SOT886)     		SOT886REFLOW_BG-BD-1
    		SOT886_125Active5N74AUP1G16GMH
    ( 9353 075 35125 )
    74AUP1G16GW
    TSSOP5
    (SOT353-1)     		SOT353-1WAVE_BG-BD-1
    		SOT353-1_125Active5N74AUP1G16GWH
    ( 9353 075 34125 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP1G16GM74AUP1G16GMH74AUP1G16GMAlways Pb-free
    74AUP1G16GW74AUP1G16GWH74AUP1G16GWAlways Pb-free
    品质及可靠性免责声明

    文档 (9)

    文件名称标题类型日期
    74AUP1G16Low-power bufferData sheet2023-07-17
    aup1g1674AUP1G16 IBIS modelIBIS model2015-10-29
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
    SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    aup1g1674AUP1G16 IBIS modelIBIS model2015-10-29

    订购、定价与供货

    样品

    安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

    样品订单通常需要2-4天寄送时间。

    如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品

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