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    NXS0104

    Dual supply translating transceiver; open drain; auto direction sensing

    The NXS0104 is a 4-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 4-bit input-output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.65 V and 3.6 V and VCC(B) can be supplied at any voltage between 2.3 V and 5.5 V, making the device suitable for translating between any of the voltage nodes (1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range:

      • VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V

    • Maximum data rates:

      • Push-pull: 24 Mbps

    • IOFF circuitry provides partial Power-down mode operation

    • Inputs accept voltages up to 5.5 V

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

      • IEC61000-4-2 contact discharge exceeds 8000 V for B port

    • Latch-up performance exceeds 100 mA per JESD 78B Class II

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    目标应用

    • Desktop PC

    • Handset

    • Smartphones

    • Tablet

    参数类型

    Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    NXS0104BQProduction1.65 - 3.62.3 - 5.5CMOS- 0.02 / 1.06.04low-40~1259612.864DHVQFN14
    NXS0104GU12Production1.65 - 3.62.3 - 5.5CMOS- 0.02 / 1.06.04low-40~125---XQFN12
    NXS0104PWProduction1.65 - 3.62.3 - 5.5CMOS- 0.02 / 1.06.04low-40~1251334.958TSSOP14
    NXS0104UMProduction1.65 - 3.62.3 - 5.5CMOS- 0.02 / 1.06.04low-40~125---WLCSP12

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    NXS0104BQ
    DHVQFN14
    (SOT762-1)     		SOT762-1SOT762-1_115ActiveS0104NXS0104BQX
    ( 9356 906 92115 )
    NXS0104GU12
    XQFN12
    (SOT1174-1)     		SOT1174-1SOT1174-1_115ActiveStandard MarkingNXS0104GU12X
    ( 9356 906 93115 )
    NXS0104PW
    TSSOP14
    (SOT402-1)     		SOT402-1SSOP-TSSOP-VSO-WAVE
    		SOT402-1_118ActiveNXS0104NXS0104PWJ
    ( 9356 906 91118 )
    NXS0104UM
    WLCSP12
    (SOT8019-1)     		SOT8019-1SOT8019-1_336Activem4NXS0104UMAZ
    ( 9356 911 08336 )

    下表中的版本已停产。参见表 停产信息 了解更多信息。

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    NXS0104UM
    WLCSP12
    (SOT8019-1)     		SOT8019-1SOT8019-1_084Discontinued / End-of-lifem4NXS0104UMZ
    ( 9356 911 08084 )

    停产信息

    型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
    NXS0104UM935691108084

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    NXS0104BQNXS0104BQXNXS0104BQweek 25, 2019
    NXS0104GU12NXS0104GU12XNXS0104GU12week 25, 2019
    NXS0104PWNXS0104PWJNXS0104PWweek 25, 2019
    NXS0104UMNXS0104UMAZNXS0104UM

    下表中的版本已停产。参见表 停产信息 了解更多信息。

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    NXS0104UMNXS0104UMZNXS0104UM
    品质及可靠性免责声明

    文档 (7)

    文件名称标题类型日期
    NXS0104Dual supply translating transceiver; open drain; auto direction sensingData sheet2024-04-04
    nxs0104NXS0104 IBIS modelIBIS model2020-11-05
    SOT762-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm bodyPackage information2023-04-05
    SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
    SOT402-1plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm bodyPackage information2023-11-07
    SOT1174-1plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm bodyPackage information2024-04-11
    SOT8019-1 (Working Copy)wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mmPackage information2022-02-11

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    nxs0104NXS0104 IBIS modelIBIS model2020-11-05

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