特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide supply voltage range from 1.2 V to 3.6 V
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Inputs accept voltages up to 5.5 V
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CMOS low power consumption
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Direct interface with TTL levels
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Complies with JEDEC standard:
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JESD8-7A (1.65 V to 1.95 V)
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JESD8-5A (2.3 V to 2.7 V)
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JESD8-C/JESD36 (2.7 V to 3.6 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVCU04AD-Q100 | Production | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 6 | low | -40~125 | 111 | 21.9 | 69 | SO14 |
| 74LVCU04APW-Q100 | Production | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 6 | low | -40~125 | 143 | 8.46 | 69.4309933628319 | TSSOP14 |
封装
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| 74LVCU04AD-Q100 |  SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74LVCU04AD | 74LVCU04AD-Q100J ( 9353 044 98118 ) |
| 74LVCU04APW-Q100 |  TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | LVCU04A | 74LVCU04APW-Q100J ( 9353 044 99118 ) |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| 74LVCU04AD-Q100 | 74LVCU04AD-Q100J | 74LVCU04AD-Q100 |  |   | Always Pb-free |
| 74LVCU04APW-Q100 | 74LVCU04APW-Q100J | 74LVCU04APW-Q100 | | | Always Pb-free |
文档 (12)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74LVCU04A_Q100 | Hex unbuffered inverter | Data sheet | 2024-02-28 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| lvcu04a | lvcu04a IBIS model | IBIS model | 2013-04-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| lvc | lvc Spice model | SPICE model | 2013-05-06 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
支持
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样品
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